Intevac Announces Participation in 11th Annual NYC Summit

Intevac, Inc. (Nasdaq: IVAC), a leading supplier of thin-film processing systems, today announced management’s participation in the 11^th Annual NYC Summit, being held Tuesday, December 13^th at Mastro’s New York.

The presentation material utilized during the NYC Summit will be made accessible on the events page of the Company’s website at https://ir.intevac.com.

About the 11^th Annual NYC Summit

The NYC Summit is collectively hosted and funded by participating companies and features a “round-robin” format consisting of small group meetings with company management teams. During the event, investors and analysts will have the opportunity to meet with the majority of the 12 management teams during the small group meeting sessions, as well as opportunities to meet with management during the breakfast and lunch networking sessions.

The 12 management teams collectively hosting the 11^th Annual NYC Summit 2022 include: ACM Research (ACMR), Advanced Energy (AEIS), Aehr Test (AEHR), Alpha & Omega Semiconductor (AOSL), Axcelis (ACLS), FormFactor (FORM), Ichor Systems (ICHR), inTEST (INTT), Intevac (IVAC), Kulicke & Soffa (KLIC), Onto Innovation (ONTO), and SkyWater Technology (SKYT). Both Cowen and Stifel are sponsors of the conference.

Attendance at the NYC Summit is by invitation only and is available solely to accredited investors and publishing research analysts. As space is limited, please RSVP early. Hosts reserve the right to limit attendance as necessary. Last day for registration is December 1, 2022.

RSVP Contacts for 11^th Annual NYC Summit 2022

To RSVP for the NYC Summit, please contact either of the Summit’s co-chairs.

About Intevac

Founded in 1991, we are a leading provider of thin-film process technology and manufacturing platforms for high-volume manufacturing environments. As a long-time supplier to the hard disk drive (HDD) industry, over the last 20 years we have delivered over 180 of our industry-leading 200 Lean® systems, which currently represent the majority of the world’s capacity for HDD disk media production. Today, we believe that all of the technology upgrade initiatives for next-generation media for the HDD industry, along with planned media capacity additions over the next several years, are being deployed on our 200 Lean platform. With over 30 years of leadership in designing, developing, and manufacturing high-productivity, thin-film processing systems, we are now leveraging our technology and know-how for new, advanced coating applications in large growth markets, such as consumer and automotive displays. For more information call 408-986-9888, or visit the Company's website at www.intevac.com.

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